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Pehea e hana ai i ka huʻa keleawe?

ʻO ka wehewehe pōkole:

ʻO ka pahu keleawe he ʻano hou o nā mea multifunctional me ka nui o nā pores i hoʻopili ʻia a i ʻole pili ʻole i hoʻohele like ʻia ma ka matrix keleawe. He maikaʻi ka conductivity a me ka ductility ʻo Copper foam. Hoʻohālikelike ʻia me ka nickel foam, he haʻahaʻa haʻahaʻa ka hoʻomākaukau ʻana a me ka conductivity maikaʻi, a hiki ke hoʻohana ʻia e hoʻomākaukau i ka pākaukau ʻino electrode (carrier) mea, catalyst carrier a me nā mea pale electromagnetic.
ʻO ka mea nui, loaʻa i ke keleawe foamed kekahi mau pōmaikaʻi ma ke ʻano he substrate no nā electrodes pākaukau, akā no ka mea ʻaʻole like ke keleawe e like me ka corrosion e like me ka nickel, ua kaupalena ʻia kekahi o kāna mau noi.

Huahana Huahana

Huahana Huahana

Puhu keleawe-01
ʻO ka pahu keleawe he ʻano hou o nā mea multifunctional me ka nui o nā pores i hoʻopili ʻia a i ʻole pili ʻole i hoʻohele like ʻia ma ka matrix keleawe. He maikaʻi ka conductivity a me ka ductility ʻo Copper foam. Hoʻohālikelike ʻia me ka nickel foam, he haʻahaʻa haʻahaʻa ka hoʻomākaukau ʻana a me ka conductivity maikaʻi, a hiki ke hoʻohana ʻia e hoʻomākaukau i ka pākaukau ʻino electrode (carrier) mea, catalyst carrier a me nā mea pale electromagnetic.
ʻO ka mea nui, loaʻa i ke keleawe foamed kekahi mau pōmaikaʻi ma ke ʻano he substrate no nā electrodes pākaukau, akā no ka mea ʻaʻole like ke keleawe e like me ka corrosion e like me ka nickel, ua kaupalena ʻia kekahi o kāna mau noi.
Hoʻomākaukau ʻia ke keleawe puaʻa e ka metallurgy pauka a me ka electroplating, a ua hoʻomākaukau ʻia ka metala puaʻa ma ka hoʻohui ʻana i kahi mea hoʻohua i loko o ka metala i hoʻoheheʻe ʻia;
1.Powder metallurgy metala huʻihuʻi i hana ʻia ma ka hoʻohui ʻana i kahi mea puhi puhi (e like me NH4Cl) i ka pauka, hoʻololi ka mea puhi i ka wā o ka sintering, e waiho ana i nā ʻole.
2. Hiki ke hoʻohana ʻia ke ʻano hoʻoheheʻe electrochemical no ka hoʻomākaukau ʻana i ka metala foamed me ke ʻano maʻamau a me ka porosity a hiki i ka 95%, me nā pahu metala me Cu, Ni, NiCrFe, ZnCu, NiCu, NiCrW, NiFe a me nā metala ʻē aʻe a me nā mea e like me nā iwi.

Hoʻokomo ʻia ka metala ma ke kino porous e ke ʻano electrochemical, a ua hui pū ʻia nā mea i waiho ʻia e ka sintering, a hiki i ka ikaika i ka pahu metala kiʻekiʻe-porosity i koi ʻia, he porosity kiʻekiʻe a hiki ke hoʻopiha ʻia me nā mea hou aku, e like me nā catalysts. . , electrolyte, etc.
3. Puka-pukahuʻa keleaweua hoʻomākaukau ʻia e ke kaʻina sintering-desolvation, a ua hui pū ʻia ka pauka keleawe electrolytic, nā ʻāpana NaCl a me nā mea hoʻohui a paʻi ʻia i loko o nā ʻōmaʻomaʻo. Hoʻokomo ʻia ka umu sintering i loko o kahi lewa argon no ka sintering, a waiho ʻia ka huahana i loaʻa i loko o ka wai wela. Hoʻoheheʻe ʻia i loko o ka hāmeʻa, a laila holoi ʻia me ka ʻauʻau wai kani ultrasonic a me ka acetone, a hoʻomaloʻo ʻia e hana i nā pores hāmama, i haku ʻia me kahi ʻoihana ʻekolu ala i hoʻopili ʻia, me ka porosity o 50-81%, awelika pore anawaena o 0.2- 4 mm, a me ka mahele pore.

Puhu keleawe-02


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      ʻO ka wehewehe ʻana o ka huahana Copper Foam ua hoʻohana nui ʻia e like me ka hoʻomākaukau ʻana i nā mea lawe ʻino ʻole, electrode substrate o ka lithium ion battery a i ʻole wahie, cellcatalyst carrier a me nā mea pale electromagnetic. ʻO ka pahu keleawe ka mea kumu i hoʻohana ʻia ma ke ʻano he electrode o ka pākaukau, me kekahi mau mea maikaʻi. Huahana Huahana 1) He mau mea wela maikaʻi loa ka pahu keleawe, hiki ke hoʻohana nui ʻia i nā ʻāpana kaʻa / uila a me ka uila o ka radi conduction heat...