OEM/ODM Supplier Electrodeposition Of Metallic Foam - How to make copper foam? – Beihai
OEM/ODM Supplier Electrodeposition Of Metallic Foam - How to make copper foam? – Beihai Detail:
The metal is deposited on the porous body by electrochemical method, and the deposited components are joined together by sintering, and the strength reaches the required high-porosity metal foam, which has a high porosity and can be filled with more materials, such as catalysts. , electrolyte, etc.
3. Through-hole copper foam is prepared by sintering-desolvation process, and the electrolytic copper powder, NaCl particles and additives are mixed uniformly and pressed into green compacts. The sintering furnace is placed in an argon atmosphere for sintering, and the obtained product is placed in circulating hot water. Dissolved in the device, then washed with ultrasonic water bath and acetone, and finally dried to form open pores, which are composed of a three-way connected space network, with a porosity of 50-81%, an average pore diameter of 0.2-4 mm, and a pore distribution.
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We keep on with the basic principle of "quality to start with, support very first, continuous improvement and innovation to meet the customers" for your management and "zero defect, zero complaints" as the quality objective. To great our service, we offer the items with all the superior top quality at the reasonable selling price for OEM/ODM Supplier Electrodeposition Of Metallic Foam - How to make copper foam? – Beihai , The product will supply to all over the world, such as: Madras, Ottawa, Azerbaijan, We hope we can establish long-term cooperation with all of the customers. And hope we can improve competitiveness and achieve the win-win situation together with the customers. We sincerely welcome the customers from all over the world to contact us for anything you need!
By Eden from Algeria - 2017.08.21 14:13
The company's products can meet our diverse needs, and the price is cheap, the most important is that the quality is also very nice.
By Carol from Iran - 2018.02.04 14:13
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