Chip super gobvu copper foam
Product Details
Foam yemhangura inoshandiswa zvakanyanya mukugadzirira bhatiri anode inotakura zvinhu, electrode substrates yelithium ion mabhatiri kana mafuta, bhatiri catalyst carriers uye electromagnetic shielding zvinhu. Foam yemhangura, kunyanya, ine mamwe mabhenefiti akasiyana se substrate yebhatiri electrodes.
1. Copper foam ine yakanaka thermal conductivity uye magetsi ekugadzirisa magetsi, uye inogona kushandiswa se electrode matrix ye lithiamu-ion mabhatiri, masero emafuta, nickel-zinc mabhatiri uye electrode zvinhu zvemagetsi double layer capacitors.
2. Foam yemhangura inogonawo kushandiswa sechinhu chinopisa kupisa, kupisa kupisa zvinhu, kemikari catalyst carrier, electromagnetic shielding material, filter material, damping material, battery electrode material, sound insulation material, uye yakakwirira-giredhi yekushongedza zvinhu.
Main Specifications
zvinhu: foam mhangura, kuchena> 99%,
Kukura: Standard 500 * 500mm, inogona kutemwa maererano nezvinodiwa nevatengi.
Zvinoenderana nezvinodiwa nevatengi, maumbirwo akasiyana emhangura foam anogona kugadzirwa. Round foam mhangura nezvimwe.
Ukobvu: 5 ~ 65mm
Porosity: ≥95%, 5 ~ 40PPI
Kuburikidza negomba mwero: ≥95%
Kuwanda kwepamusoro: 0.1 ~ 2.0g/m3
Packaging uye Shipping
Vacuum + nitrogen yakazadzwa kurongedza, yakajairwa kunze kwemapuranga kurongedza kana zvinoenderana nezvinodiwa nevatengi.
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