I-Chip igwebu lobhedu elityebileyo
Iinkcukacha zeMveliso
I-foam ye-Copper isetyenziswa ngokubanzi ekulungiseleleni izinto ezithwala i-anode yebhetri, i-electrode substrates kwiibhetri ze-lithium ion okanye i-fuel, abathwali be-catalyst yebhetri kunye nezixhobo zokukhusela i-electromagnetic. I-foam yobhedu, ngokukodwa, ineenzuzo ezithile ezahlukileyo njenge-substrate yee-electrode zebhetri.
1. I-foam ye-Copper ine-conductivity efanelekileyo ye-thermal kunye ne-electrode conductivity yombane, kwaye ingasetyenziselwa njenge-matrix ye-electrode yeebhetri ze-lithium-ion, iiseli ze-fuel, iibhetri ze-nickel-zinc kunye nezixhobo ze-electrode zombane ze-capacitors eziphindwe kabini zombane.
2. I-foam yobhedu inokusetyenziswa njengezinto zokulahla ubushushu, izinto zokufunxa ubushushu, i-catalyst catalyst carrier, i-electromagnetic shielding material, i-filter material, i-damping material, i-electrode ye-bettery, i-sound insulation material, kunye nezinto zokuhombisa ezikumgangatho ophezulu.
Iinkcukacha eziphambili
Izinto eziphathekayo: ubhedu logwebu, ubunyulu> 99%,
Ubungakanani: Umgangatho we-500 * 500mm, unokunqunyulwa ngokweemfuno zabathengi.
Ngokweemfuno zabathengi, iimilo ezahlukeneyo ze-foam yobhedu zinokuveliswa. Ubhedu olujikelezileyo lwe-foam njl.
Ukutyeba: 5 ~ 65mm
I-Porosity: ≥95%, 5 ~ 40PPI
Ngomlinganiselo womngxuma: ≥95%
Ukuxinana komphezulu: 0.1 ~ 2.0g/m3
Ukupakishwa kunye nokuThunyelwa
Ivacuum + ukupakishwa okuzaliswe yinitrogen, ukupakishwa okusemgangathweni kwamaplanga kumazwe angaphandle okanye ngokweemfuno zabathengi.






