Mea uila no ka hana hydrogen - nickel foam
Hōʻike huahana
Hoʻokumu ʻia kēia huahana me ka pahuhopu e hoʻomaikaʻi i ka pono o ka hana hydrogen. He nui nā patent i ka hui e pili ana i ka nickel foam no ka hana hydrogen. Keia huahana hoʻohana conductive sponge e like me ka matrix, a hoomakaukau kiʻekiʻe-performance foamed nickel ma o nā kaʻina hana e like me electrodeposition o metala nickel, kiʻekiʻe wela oxidation, a me ka hydrogen pale hoemi. Nui ka ʻili o ka huahana, ikaika maikaʻi, paʻakikī a me ka pale ʻana i ka corrosion, a hiki ke hana ʻia i loko o ka ʻōwili nickel foam a me ka pepa nickel foam e like me nā noi kūpono, a loaʻa nā mānoanoa like ʻole.
Nā Kūlana Huahana
| Papahana | Nā kikoʻī hiki ke hana ʻia | Hōʻike kikoʻī | |
| Ka helu o nā puka (ppi) | 8-110(±2/5/10) | 110±10 | 13±2 |
| ʻĀpana ʻāpana (g/m2) | 250-5000(±5%) | 380±25 | 2000±100 |
| Ana (mm) | 20-1000(±0.5/1.0/2.0) | 500±0.5 | 500±2 |
| ʻO waho | ʻAhinahina kala, ʻaʻohe kiko ʻeleʻele, nā kiko makapō, ma nā lua, nā māwae a me nā hemahema ʻē aʻe | ||
| haku mele ʻana | Nikela (Ni): ≥99.9% | Hao (Fe): ≤0.010% | |
| Kalapona (C): ≤0.030% | Sulfur (S):≤0.008% | ||
| Silika (Si): 0.005% | Ke keleawe (Cu): ≤0.005% | ||
Hoohana Huahana
Hoʻohana nui ʻia ka huahana no ka hana hydrogen e ka electrolysis o ka wai.






